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Borrow APY0.06%Variable rate Supply APY0.00%Variable rate Available liquidity$385.70Ready to borrow Utilization0.0%Borrowed share
LiveVerified assets
TSM/USDG
Use Taiwan Semiconductor Manufacturing • Robinhood Token as collateral to borrow Global Dollar.
Updated 17:05 UTC
Risk boundary
Know the market limit.
63%LLTVLiquidation threshold
Your loan-to-value is measured against the oracle value of your collateral. Keep a meaningful buffer below the market limit as prices and rates change.
0%25%50%75%63%100%
Liquidation boundaryConfiguration
Market terms
Every value below belongs to this isolated market.
- Oracle
0x11Dc…B08BChainlinkOracleV2- Liquidation LTV
- 63%
- Interest-rate model
0x2BD3…0fa1- Market contract
0x9D53…1010- Total supplied
- 385.6145 USDG
- Total borrowed
- 0 USDG
- Collateral asset
- TSMTaiwan Semiconductor Manufacturing • Robinhood Token
- Loan asset
- USDGGlobal Dollar